内部导电金浆D6M-225 Internal Au Conductor Paste
我们研制了与SYJ-D6M相配套的多种金浆/银浆、过渡浆及电阻浆，以契合LTCC航天领域多种应用。
我司专业的玻璃和金属材料技术使我们可以定制多种不同浆料以满足多种应用。
1.产品介绍 Product Introduction
D6M-225导电金浆是-D6M LTCC系列的一款多功能材料。金浆产品D6M瓷带有良好兼容性，可用于：埋置互连层、埋置电阻。此外，225也可用作D6M体系可钎焊材料的粘合层。
D6M-225 gold conductor paste is a versatile material in the D6M LTCC materials system. The product has been designed for optimized compatibility with D6M dielectric tape, and may be used for: Buried interconnect layers, Termination of buried and surface resistor pastes, Co-fired internal and external ground planes, Co-fired and external layers,Au wire bondable surface layers. Additionally, 225 is used as the adhesion layer for the brazable materials in the SYJ-D6M system.
2. 产品性能 Product Performance
参数 Typical Conductor Properties | 规格 specifications |
粘度1 Viscosity | <120Pa·s |
固含量Solid Content | 81% |
印刷厚度Print Thickness | |
干燥Dry | 15-20μm |
烧结Fried | 8-12μm |
电阻率2 Resistivity | <3mΩ/sq |
备注：
1数据由粘度检测设备Wells-Brookfield DV2T cp51检测提供(9.6s-1, 25°C)
2归一化到25.4μm的标准烧结厚度
Notes:
1Measured using Wells-Brookfield DV2T cp51 viscometer, 9.6s-1,25°C.
2Normalized to 1 mil (25.4 µm) fired thickness.
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