表面导电金浆D6M-280 Wirebondable Gold
我们研制了与SYJ-D6M相配套的多种金浆/银浆、过渡浆及电阻浆，以契合LTCC航天领域多种应用。
我司专业的玻璃和金属材料技术使我们可以定制多种不同浆料以满足多种应用。
1.产品介绍 Product Introduction
D6M-280是用于D6M LTCC系统的导电金浆，旨在满足高键合强度应用的需要。性能有：1、高键合强度；2、与D6M陶瓷体的良好附着力；3、可在多种燃烧条件下进行处理（空气流量不重要）；4、清洁导体表面；5、良好的接触电阻。大面积金浆不建议使用JD-280。
D6M-280 is a Au conductor paste for the D6M LTCC system designed to meet the need for high wirebond strength applications. The properties are: 1) good wirebond strength; 2) excellent adhesion to D6M ceramic body; 3) can be processed in a wide range of firing conditions (air-flow is not critical); 4) clean conductor surface; 5) excellent contact resistance. D6M-280 is not recommended for ground plane applications.
2. 产品性能 Product Performance
参数 Typical Conductor Properties | 规格 specifications |
粘度1Viscosity | 130±20Pa·s |
固含量Solid Content | 70% |
印刷厚度Print Thickness | |
干燥Dry | 15-20μm |
烧结Fried | 14-18μm |
电阻率2Resistivity | <2.2mΩ/sq. |
备注：
1数据由粘度检测设备Wells-Brookfield DV2T cp51检测提供(9.6s-1, 25°C)
2归一化到25.4μm的标准烧结厚度
Notes:
1Measured using Wells-Brookfield DV2T cp51 viscometer, 9.6s-1,25°C.
2Normalized to 1 mil (25.4 µm) fired thickness.
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