內部導電金漿D6M-225 Internal Au Conductor Paste
我們研製了與SYJ-D6M相配套的多種金漿/銀漿、過渡漿及電阻漿，以契合LTCC航天領域多種應用。
我司專業的玻璃和金屬材料技術使我們可以定製多種不同漿料以滿足多種應用。
1.產品介紹 Product Introduction
D6M-225導電金漿是-D6M LTCC系列的一款多功能材料。金漿產品D6M瓷帶有良好兼容性，可用於：埋置互連層、埋置電阻。此外，225也可用作D6M體系可釺焊材料的粘合層。
D6M-225 gold conductor paste is a versatile material in the D6M LTCC materials system. The product has been designed for optimized compatibility with D6M dielectric tape, and may be used for: Buried interconnect layers, Termination of buried and surface resistor pastes, Co-fired internal and external ground planes, Co-fired and external layers,Au wire bondable surface layers. Additionally, 225 is used as the adhesion layer for the brazable materials in the SYJ-D6M system.
2. 產品性能 Product Performance
參數 Typical Conductor Properties | 規格 specifications |
粘度1 Viscosity | <120Pa·s |
固含量Solid Content | 81% |
印刷厚度Print Thickness | |
幹燥Dry | 15-20μm |
燒結Fried | 8-12μm |
電阻率2 Resistivity | <3mΩ/sq |
備注：
1數據由粘度檢測設備Wells-Brookfield DV2T cp51檢測提供(9.6s-1, 25°C)
2歸一化到25.4μm的標準燒結厚度
Notes:
1Measured using Wells-Brookfield DV2T cp51 viscometer, 9.6s-1,25°C.
2Normalized to 1 mil (25.4 µm) fired thickness.
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