通孔導電銀漿D6M-022 Sliver Via Fill Paste
我們研製了與SYJ-D6M相配套的多種金漿/銀漿、過渡漿及電阻漿，以契合LTCC航天領域多種應用。
我司專業的玻璃和金屬材料技術使我們可以定製多種不同漿料以滿足多種應用。
1.產品介紹 Product Introduction
D6M-022是一款低電阻率的灌孔導電銀漿，是高頻應用和控製成本的理想選擇。D6M-022與銀漿D6M-033兼容。匹配實驗結果由D6M共燒提供數據。
D6M-022 having a low resistivity, is an ideal choice for high frequency applications where cost is of paramount importance. D6M-022 is also compatible with YJ's D6M-033. The matching experiment results is provided by D6M co-firing.
2.產品性能 Product Performance
參數 Typical Conductor Properties | 規格 specifications |
粘度1Viscosity | 1000Pa·s |
固含量Solid Content | 88.5-91.5% |
電阻率2Resistivity | ≤2mΩ/sq. |
備注：
1數據由粘度檢測設備Wells-Brookfield DV2T cp51檢測提供(9.6s-1, 25°C)
2歸一化到25.4μm的標準燒結厚度
Notes:
1Measured using Wells-Brookfield DV2T cp51 viscometer, 9.6s-1,25°C.
2Normalized to 1 mil (25.4 µm) fired thickness.
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