後燒銀漿D6M-099 Sliver Post-fired Paste
我們研製了與SYJ-D6M相配套的多種金漿/銀漿、過渡漿及電阻漿，以契合LTCC航天領域多種應用。
我司專業的玻璃和金屬材料技術使我們可以定製多種不同漿料以滿足多種應用。
1.產品介紹 Product Introduction
D6M-099具有低電阻率，是高頻應用和控製成本的理想選擇，與D6M LTCC瓷帶和銀漿體系產品兼容性優異 。
D6M-099 having a low resistivity, is an ideal choice for high frequency applications where cost is of paramount importance. D6M-099 displays excellent compatibility with the fired D6M LTCC ceramic and all of the products in YJ-D6M LTCC ASB (All Silver Based) Materials System.
2.產品性能 Product Performance.
參數 Typical Conductor Properties | 規格 specifications |
可焊性1Solderablity | 3 |
耐焊性2Solder Leach Resistance | 10-14 |
印刷厚度Print Thickness | |
幹燥Dry | 15-20μm |
燒結Fired | 8-12μm |
電阻率3Resistivity | 1.5mΩ/sq. |
備注：
1浸料達到>95%覆蓋率用秒（Sn62焊料，215℃）
21秒內浸料熔蝕<80%次數（Sn62焊料，215℃）
3歸一化到25μm的標準燒結厚度
Notes:
1Dip seconds to reach >95% coverage, Sn62 solder,215°C.
2Number of 1 second dips to <80% wetting, Sn62 solder, 215°C.
3Normalized to 25 µm fired thickness.
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