過表漿D6M-320 Transition Solderable Paste
我們研製了與SYJ-D6M相配套的多種金漿/銀漿、過渡漿及電阻漿，以契合LTCC航天領域多種應用。
我司專業的玻璃和金屬材料技術使我們可以定製多種不同漿料以滿足多種應用。
1.產品介紹 Product Introduction
D6M-320是一種必須與D6M多層結構中的可焊端共燒的鉑金導電漿料。
該產品可以直接處理，並與D6M AGB(全金基)和D6M MMM(混合金屬材料)系統中的所有材料兼容。
加工後的D6M-320在與傳統錫/鉛基焊料一起使用時顯示出優異的可焊性，高粘合強度和出色的抗浸出性。
D6M-320 is a co-fireable platinum gold conductor paste which must be used to cofire solderable terminations onto D6M multi-layer structures.
The product is straight forward to process and compatible with all the materials in the D6M AGB (All Gold Based) and D6M MMM (Mixed Metals Materials) Systems.
After processing D6M-320 displays excellent solderablity, high adhesion strength and outstanding leach resistance when used with conventional tin/lead based solders.
2.產品性能 Product Performance
參數 Typical Conductor Properties | 規格 specifications |
粘度1Viscosity | 190±40Pa·s |
固含量Solid Content | 72% |
細度Fineness of Grind | ≤20μm |
電阻率2Resitivity | <50mΩ/sq. |
線清晰度3Line Resolution | 127 µm line/space |
印刷厚度Print Thickness | |
幹燥Dry | 25-40μm |
燒結Fried | 14-18μm |
可焊性4Solderablity | >95% |
浸出阻力Leach resistance | <10% |
粘合度5Adhesion | >13N |
備注：
1數據由粘度檢測設備Wells-Brookfield DV2T cp51檢測提供(9.6s-1, 25°C)
2歸一化到25.4μm的標準燒結厚度
3浸料達到>95%熔蝕用秒（Sn60焊料，230℃）
4<80%熔蝕浸泡時間（Sn60，230℃)
590°線剝離試驗，2.5X2.5 mm襯墊
Notes:
1Measured using Wells-Brookfield DV2T cp51 visocometer,9.6s-1. 25℃
2Normalized to 1 mil (25.4µm) fired thickness
3Dip seconds to reach >95% wetting, Sn60 solder, 230℃
4Immersion time to <80% wetting, Sn60, 230℃
590°wired peel test, 2.5X2.5 mm pads
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