表面導電銀漿D6S- 191 Solderable Sliver Conductor Paste
我們研製了與SYJ-D6S相配套的系列導電漿料，以契合LTCC通訊、汽車等民用領域的應用。
我司專業的玻璃和金屬材料技術使我們可以定製多種不同漿料以滿足多種應用。
1.產品介紹 Product Introduction
D6S-191是一款低電阻率的可焊接導電銀漿，是高頻應用和控製成本的理想選擇。D6S-191與灌孔銀漿D6S-143兼容。匹配實驗結果由D6S共燒提供數據。
D6S-191 having a low resistivity, is an ideal choice for high frequency applications where cost is of paramount importance. D6S-191 is also compatible with YJ's via fill D6S-143. The matching experiment results is provided by D6S co-firing.
2.產品性能 Product Performance
參數 Typical Conductor Properties | 規格 specifications |
粘度1Viscosity | <120Pa·s |
固含量Solid Content | >70% |
印刷厚度Print Thickness | |
幹燥Dry | 9-12μm |
燒結Fried | 6-9μm |
焊接性Solderability | >95% |
電阻率2Resistivity | <1mΩ/sq. |
浸出阻力Leach resistance | >80% |
備注：
1數據由粘度檢測設備Wells-Brookfield DV2T cp51檢測提供(9.6s-1, 25°C)
2歸一化到25.4μm的標準燒結厚度
Notes:
1Measured using Wells-Brookfield DV2T cp51 viscometer, 9.6s-1,25°C.
2Normalized to 1 mil (25.4 µm) fired thickness.
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