表面導電金漿D6M-280 Wirebondable Gold
我們研製了與SYJ-D6M相配套的多種金漿/銀漿、過渡漿及電阻漿，以契合LTCC航天領域多種應用。
我司專業的玻璃和金屬材料技術使我們可以定製多種不同漿料以滿足多種應用。
1.產品介紹 Product Introduction
D6M-280是用於D6M LTCC系統的導電金漿，旨在滿足高鍵合強度應用的需要。性能有：1、高鍵合強度；2、與D6M陶瓷體的良好附著力；3、可在多種燃燒條件下進行處理（空氣流量不重要）；4、清潔導體表面；5、良好的接觸電阻。大面積金漿不建議使用JD-280。
D6M-280 is a Au conductor paste for the D6M LTCC system designed to meet the need for high wirebond strength applications. The properties are: 1) good wirebond strength; 2) excellent adhesion to D6M ceramic body; 3) can be processed in a wide range of firing conditions (air-flow is not critical); 4) clean conductor surface; 5) excellent contact resistance. D6M-280 is not recommended for ground plane applications.
2. 產品性能 Product Performance
參數 Typical Conductor Properties | 規格 specifications |
粘度1Viscosity | 130±20Pa·s |
固含量Solid Content | 70% |
印刷厚度Print Thickness | |
幹燥Dry | 15-20μm |
燒結Fried | 14-18μm |
電阻率2Resistivity | <2.2mΩ/sq. |
備注：
1數據由粘度檢測設備Wells-Brookfield DV2T cp51檢測提供(9.6s-1, 25°C)
2歸一化到25.4μm的標準燒結厚度
Notes:
1Measured using Wells-Brookfield DV2T cp51 viscometer, 9.6s-1,25°C.
2Normalized to 1 mil (25.4 µm) fired thickness.
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