後燒金漿D6M-207 Post-fired Au Conductor Paste
我們研製了與SYJ-D6M相配套的多種金漿/銀漿、過渡漿及電阻漿，以契合LTCC航天領域多種應用。
我司專業的玻璃和金屬材料技術使我們可以定製多種不同漿料以滿足多種應用。
1.產品介紹 Product Introduction
該產品是在D6M-225金漿粘貼層上後燒成的，可用於各種釺焊材料金屬絲、絲帶、預製件或錫膏。D6M-207可與所有常用的金基釺焊材料釺焊，以實現鍍金的Kovar, Invar和類似材料和D6M LTCC的焊接。
The product is post fired over adhesion layers of D6M-225 gold conductor paste, and may be used with a variety of brazing materials, in the form of wire, ribbon, preform or paste.D6M-207 may be brazed with all commonly used Au-based brazing materials, to join gold plated Kovar, Invar and similar materials to D6M LTCC.
2.產品性能 Product Performance
參數 Typical Conductor Properties | 規格 specifications |
粘度1Viscosity | 110Pa·s |
固含量Solid Content | 87% |
電阻率2Resistivity | <2mΩ/sq. |
備注：
1數據由粘度檢測設備Wells-Brookfield DV2T cp51檢測提供(9.6s-1, 25°C)
2歸一化到25.4μm的標準燒結厚度
Notes:
1Measured using Wells-Brookfield DV2T cp51 viscometer, 9.6s-1,25°C.
2Normalized to 1 mil (25.4 µm) fired thickness.
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