過孔漿D6S-305 Transition Via Fill Paste
1.產品介紹 Product Introduction
D6S-305是為 D6S LTCC多層結構中埋置銀基導體與表面金基導體之間的通孔連接而製。D6S-305用於優化電導率，從而提供高可靠度的互連。
D6S LTCC結構利用埋置層中銀的高導電性，與表面金基材料，以實現高可靠性，密封陶瓷封裝在極端環境中的使用。
D6S-305 has been formulated for use in the via connection between buried silver-based conductors, and external gold based conductors in the D6S LTCC multilayer structure. D6S-305 was developed for optimized conductivity to provide a highly reliable interconnect.
The D6S LTCC construction takes advantage of silver’s high conductivity for buried layers, with external layers of gold based materials, to produce high reliability, hermetic ceramic packages to be used in the most hostile of environments.
2.產品性能 Product Performance
參數 Typical Conductor Properties | 規格 specifications |
粘度1Viscosity | 115±25Pa·s |
固含量Solid Content | 90% |
細度Fineness of Grind | ≤25μm |
線清晰度2Line Resolution | 100 µm line/space |
備注：
1數據由粘度檢測設備Wells-Brookfield DV2T cp51檢測提供（9.6s-1, 25°C)
2可在標準通孔加工條件下生產的最小通孔孔徑推薦。
1 Measured using Wells-Brookfield DV2T cp51 viscometer, 9.6s-1, 25°C.
2 Minimum recommended via diameter which may be produced with standard via processing conditions.
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