過表漿D6S-320 Transition Solderable Paste
1.產品介紹 Product Introduction
D6S-320是一種必須與 D6S多層結構中的可焊端共燒的鉑金導電漿料。
該產品可以直接處理，並與 D6S AGB(全金基)和 D6S MMM(混合金屬材料)系統中的所有材料兼容。加工後的D6S-320在與傳統錫/鉛基焊料一起使用時顯示出優異的可焊性，高粘合強度和出色的抗浸出性。
D6S-320 is a co-fireable platinum gold conductor paste which must be used to cofire solderable terminations onto D6S multi-layer structures.
The product is straight forward to process and compatible with all the materials in the D6S AGB (All Gold Based) and D6S MMM (Mixed Metals Materials) Systems. After processing D6S-320 displays excellent solderablity, high adhesion strength and outstanding leach resistance when used with conventional tin/lead based solders.
2.產品性能 Product Performance
參數 Typical Conductor Properties | 規格 specifications |
粘度1Viscosity | 190±40Pa·s |
固含量Solid Content | 72% |
細度Fineness of Grind | ≤20μm |
電阻率2Resitivity | <50mΩ/sq |
線清晰度3Line Resolution | 127 µm line/space |
印刷厚度Print Thickness | |
幹燥Dry | 25-40μm |
燒結Fried | 14-18μm |
可焊性4Solderablity | ≤3 |
浸出阻力Leach resistance | ≥7 min |
粘合度5Adhesion | ≥22N |
備注：
1數據由粘度檢測設備Wells-Brookfield DV2T cp51檢測提供(9.6s-1, 25°C)
2歸一化到25.4μm的標準燒結厚度
3浸料達到>95%熔蝕用秒（Sn60焊料，230℃）
4<80%熔蝕浸泡時間（Sn60，230℃)
590°線剝離試驗，2.5X2.5 mm襯墊
Notes:
1Measured using Wells-Brookfield DV2T cp51 visocometer,9.6s-1. 25℃
2Normalized to 1 mil (25.4µm) fired thickness
3Dip seconds to reach >95% wetting, Sn60 solder, 230℃
4Immersion time to <80% wetting, Sn60, 230℃
590°wired peel test, 2.5X2.5 mm pads
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